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发明名称
供半导体装置导线用之钛底层
摘要
本发明系有关于在矽基材上之金属线中,包含于钛含量较多之氮化钛层底部使用薄钛底层。
申请公布号
TW200416952
申请公布日期
2004.09.01
申请号
TW093101266
申请日期
2004.01.16
申请人
矽系统工业股份有限公司
发明人
黄锦鸿;黄耀强;许少菲
分类号
H01L21/768
主分类号
H01L21/768
代理机构
代理人
吴冠赐;杨庆隆;苏建太
主权项
地址
新加坡
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