SEMICONDUCTOR DEVICE AND RADIATION DETECTOR EMPLOYING IT

摘要

A glass substrate provided with a through hole group (20d) of a plurality of through holes (20c) made, in a specified arrangement, to extend from an input surface (20a) to an output surface (20b), and conductive members (21) formed on the inner wall of the through holes (20c) included in the through hole group (20d) to conduct electrically between the input surface (20a) and the output surface (20b) constitute a wiring board (20) for connecting a semiconductor element (10). Bump electrodes (12) of the semiconductor element (10) being connected with the input surface (20a) correspond to the through hole group (20d), the conductive members (21), and a conductor (22) formed in a region covering the through hole group (20d), and are connected such that the bump electrodes (12) partially enter the plurality of through holes (20c), respectively. A semiconductor device in which a semiconductor element is connected well with a corresponding conduction line on the wiring board, and a radiation detector employing it, are thereby obtained.