发明名称 Thermal dissipation assembly for electronic components
摘要 An electrical assembly 10 is provided, including a heat sink 14, a heat generating component 12, a gap 22 defined between the heat generating component 12 and the heat sink 14, at least one pre-cured thermal adhesive member 26 positioned within the gap 22, and a post-cured thermal adhesive filling said gap 22.
申请公布号 US6804118(B2) 申请公布日期 2004.10.12
申请号 US20020099898 申请日期 2002.03.15
申请人 DELPHI TECHNOLOGIES, INC. 发明人 KATARIA VIJAY
分类号 H01L23/373;(IPC1-7):H05K7/20;B21D53/02 主分类号 H01L23/373
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