发明名称 SUBSTRATE PROCESS EQUIPMENT, COATING UNIT AND COATING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate process equipment, a coating unit and a coating method capable of adhering the substrate on an adhesion board with the substrate surface to be processed directed downward, without a rotating mechanism. <P>SOLUTION: The substrate process equipment has a coating unit 1a which forms a coating film on the surface to be coated by: raising the coating liquid pooled in a lower position than a substrate 10 by the capillarity of a substrate process means 2; making the raised coating liquid contact to the surface of the substrate 10 to be coated directed downward; and moving the substrate process means 2 relatively to the substrate 10. The coating unit 1a includes a hold means 5a for detachably holding the substrate 10; an adhesion means 3 for adhering the substrate 10 from the hold means 5a with the surface of the substrate 10 to be processed directed downward; and a moving means 4 for moving the substrate process means 2 and/or the adhesion means 3 in a horizontal plane. With the above hold means for detachably holding the substrate, the adhesion means for adhering the substrate from the hold means with the substrate surface to be processed directed downward, and the moving means for moving the substrate process means and/or the adhesion means in the horizontal plane, it becomes possible to enhance a position precision between the surface to be coated and a nozzle, particularly the position precision of the vertical direction which greatly influences the quality of film thickness, and to attain a more uniform film thickness. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004327963(A) 申请公布日期 2004.11.18
申请号 JP20040071234 申请日期 2004.03.12
申请人 HOYA CORP 发明人 MOTOMURA SHUHO
分类号 G03F7/16;B05C3/18;B05C5/02;B05C11/105;B05C13/02;B05D1/26;B05D7/00;H01L21/00;H01L21/027;H01L21/68 主分类号 G03F7/16
代理机构 代理人
主权项
地址