发明名称 |
Laminate circuit structure and method of fabricating |
摘要 |
A substrate and a method of making the substrate is provided. The substrate includes a layer of metal with at least one through hole therein, the layer of metal having an adhesion promoting layer thereon. A layer of a partially cured low-loss polymer or polymer precursor is positioned on the adhesion promoting layer and a plurality of conductive circuit lines are positioned on a portion of the partially cured dielectric layer. The substrate can be used as a building block in the fabrication of a multilayered printed circuit board.
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申请公布号 |
US6820332(B2) |
申请公布日期 |
2004.11.23 |
申请号 |
US20020196993 |
申请日期 |
2002.07.16 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
JAPP ROBERT M.;MARKOVICH VOYA R.;PAPATHOMAS KONSTANTINOS I. |
分类号 |
H05K1/05;H05K3/38;(IPC1-7):H01K3/10 |
主分类号 |
H05K1/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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