| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a bump structure with well-controlled installed position, a shape and a size, and to provide a manufacturing method thereof. <P>SOLUTION: The bump structure 100 includes a projection 10 provided on an insulation layer 20 and made of a resin obtained by curing a liquid material, and a conductor layer 30 for covering the projection 10. The projection 10 is obtained by forming a liquid repelling part 40 with a liquid repelling property to a liquid material and a hydrophilic part 42 the wettability to the liquid material of which is greater than that of the liquid repelling part 40 to an upper face 20a of an insulating layer 20, and thereafter spraying the liquid material to the hydrophilic part 42 and curing the liquid material. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
