| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining method by which objective materials to be machined can be cut-off with high accuracy even in the case the objective materials to be machined have various laminate structures. <P>SOLUTION: The method is provided with a process where the back face 21 of a planar wafer 1a including a substrate 15 is mounted with an expand tape 23 having expandability; with the surface 3 of the wafer 1a as a laser light incident plane, a light-condensing point P is focused on the inside of the substrate 15, and laser light L is applied to form a fusion-processed region 13 by a multi-photon absorption; by the fusion-processed region 13, a cut-off starting point region 8 is formed on the inside of a prescribed distance from the laser light incident plane along the cut-off scheduled line 5 of the wafer 1a; and, by expanding the expand tape 23, with the cut-off starting point region 8 as the starting point, the wafer 1a is cut-off so that spaces are left among a plurality of parts. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
