发明名称 ATMOSPHERIC PRESSURE PLASMA PROCESSING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide an atmospheric pressure plasma processing device capable of preventing the atmosphere from being sucked through each side into a plasma processing space of an approximate atmospheric pressure, while securing flexibility in dimension configuration of each electrode unit. <P>SOLUTION: A first electrode unit 10 and a second electrode unit 20 are arranged in opposition to each other, and a work W is inserted into the plasma processing space 1a of approximate atmospheric pressure formed between the electrodes 11, 21. On the both sides perpendicular to the insertion direction of the work, across a first electrode 11 in the first electrode unit 10. a projecting part 16X projecting toward a main surface of the second electrode unit 20 is provided. The projecting part 16X has a board edge supporting part 16a, for holding an edge of a solid dielectric board 17 between the the board edge supporting part 16a and the first electrode 11. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005019150(A) 申请公布日期 2005.01.20
申请号 JP20030181397 申请日期 2003.06.25
申请人 SEKISUI CHEM CO LTD 发明人 YASHIRO SUSUMU;IWANE KAZUYOSHI
分类号 H05H1/46;B01J19/08;B08B7/00;C23F4/00;H01L21/304 主分类号 H05H1/46
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