发明名称 |
MULTILAYERED STRUCTURE INCLUDING EPITAXIAL LAYER WITH LOW DISLOCATION DENSITY, SEMICONDUCTOR DEVICE USING THE SAME AND FABRICATING METHOD THEREOF TO EMBODY LOW DISLOCATION DENSITY AND REDUCE THICKNESS |
摘要 |
PURPOSE: A multilayered structure including an epitaxial layer with a low dislocation density is provided to embody a low dislocation density and reduce its thickness by inserting an intermediate epitaxial layer into a hetero-epitaxial layer such that the intermediate epitaxial layer is thinner than the hetero-epitaxial layer. CONSTITUTION: A substrate is prepared. A hetero-epitaxial layer(200) is formed on the substrate, having a different lattice constant from that of the substrate. At least one intermediate epitaxial layer(300) is inserted into the hetero-epitaxial layer. The intermediate epitaxial layer has a different lattice constant from that of the hetero-epitaxial layer in contact with the intermediate epitaxial layer. The thickness of the intermediate epitaxial layer is smaller than that of the hetero-epitaxial layer to absorb the strain of the hetero-epitaxial layer.
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申请公布号 |
KR20050014318(A) |
申请公布日期 |
2005.02.07 |
申请号 |
KR20030052897 |
申请日期 |
2003.07.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, HO;LEE, HWA SUNG;LEE, SEUNG HWAN;PARK, MOON HAN;YOO, JAE YOON |
分类号 |
H01L21/20;H01L21/8238;H01L31/072;H01L31/117;(IPC1-7):H01L21/20 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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