发明名称 MULTILAYERED STRUCTURE INCLUDING EPITAXIAL LAYER WITH LOW DISLOCATION DENSITY, SEMICONDUCTOR DEVICE USING THE SAME AND FABRICATING METHOD THEREOF TO EMBODY LOW DISLOCATION DENSITY AND REDUCE THICKNESS
摘要 PURPOSE: A multilayered structure including an epitaxial layer with a low dislocation density is provided to embody a low dislocation density and reduce its thickness by inserting an intermediate epitaxial layer into a hetero-epitaxial layer such that the intermediate epitaxial layer is thinner than the hetero-epitaxial layer. CONSTITUTION: A substrate is prepared. A hetero-epitaxial layer(200) is formed on the substrate, having a different lattice constant from that of the substrate. At least one intermediate epitaxial layer(300) is inserted into the hetero-epitaxial layer. The intermediate epitaxial layer has a different lattice constant from that of the hetero-epitaxial layer in contact with the intermediate epitaxial layer. The thickness of the intermediate epitaxial layer is smaller than that of the hetero-epitaxial layer to absorb the strain of the hetero-epitaxial layer.
申请公布号 KR20050014318(A) 申请公布日期 2005.02.07
申请号 KR20030052897 申请日期 2003.07.30
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, HO;LEE, HWA SUNG;LEE, SEUNG HWAN;PARK, MOON HAN;YOO, JAE YOON
分类号 H01L21/20;H01L21/8238;H01L31/072;H01L31/117;(IPC1-7):H01L21/20 主分类号 H01L21/20
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