LEAD FRAME, RESIN-SEALED SEMICONDUCTOR DEVICE USING THE SAME, AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To suppress the separation of die pad from a sealing resin material caused by the application of thermal stress simply by changing the shape of the die pad, and to suppress the progress of a separation region even if the separation occurs.

SOLUTION: A resin-sealed semiconductor device comprises the die pad 15, a plurality of suspension leads 16a-16d for retaining the die pad, a plurality of inner leads 12 that are arranged at the periphery of the die pad and are electrically connected to the electrode pad of a semiconductor element mounted onto the die pad, a dam bar 14 formed by connecting the plurality of inner leads laterally, and an outer lead 13 provided for electrical connection with the outside corresponding to the plurality of inner leads. The above elements are supported in a frame. Each periphery of the die pad located between respective suspension leads has a curved shape recessed at the center.

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