| 摘要 |
An electronic component placement machine is disclosed that includes a series of feeders adapted to supply discrete electronic components for subsequent placement onto a destination circuit board; at least one data module coupled to each feeder, each data module comprising a memory storage device; at least one communications module coupled to each feeder, each communications module comprising a data module-transceiver coupled to a memory storage device of the associated data module; a pick head, movable between selected feeders for sequentially picking the discrete electronic components from a respective feeders for subsequent placement onto a destination circuit board; and a pick head-transceiver secured to the pick head for movement therewith between feeders, the pick head-transceiver arranged to communicate over a duplex communications channel with a data module-transceiver of a selected feeder when the pick head is positioned to pick from the selected feeder.
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