| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for a permanent resist having superior shelf stability and high temperature humidity resistance, a photosensitive film for the permanent resist, a forming method of a resist pattern, and to provide a printed wiring board. <P>SOLUTION: The photosensitive resin composition for the permanent resist contains (A) a polymer, having a carboxyl group, (B) a photopolymerizable compound having an ethylenic unsaturated bond and (C) a photopolymerization initiator and is characterized in that 0.05 to 0.3 for the total number of moles of carbon-carbon double bonds in the components (A) and (B) are contained per 100 pts.wt. total components (A) and (B). <P>COPYRIGHT: (C)2005,JPO&NCIPI |
