| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a die attach film which can be bonded to the rear surface of a wafer at a lower temperature of 110°C or lower. <P>SOLUTION: A die bond film includes an adhesive layer (A) containing a thermosetting resin containing a thermoplastic resin, or a thermosetting resin containing a thermoplastic resin and a filler, and having an average filler content of 3 vol% or less, a peeling strength when roll-pasted on a silicon mirror surface at a temperature of 60-110°C of 1 Ncm<SP>-1</SP>or more, and a glass transition temperature (Tg) in the uncured state of 50°C or lower and a surface roughness of 0.3 μm or less; and an adhesive layer (B) containing a thermosetting resin containing a thermoplastic resin and a filler, and having an average filler content of 5 to 30 vol% higher than that of the adhesive layer (A), a glass transition temperature (Tg) in the uncured state of 70°C or lower, in such a manner that the die bond film is formed of continuously stacked two-layer structure in the order of (A) and (B) and the filler content of the (A) and (B) as a whole is 5 to 30 vol%. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
