| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photopolymer composition which has high sensitivity, high resolution, and high thin line adhesion, even under a low exposure condition and is useful for manufacturing printed circuit boards or electrodes for PDPs, and to provide a photoresist film. <P>SOLUTION: This photopolymer composition is constituted containing a carboxyl group, containing polymer (A), a unsaturated ethylene compound (B), a photopolymerization initiator (C), a compound (D1) expressed by general formula (I), and a compound (D2) expressed by general formula (II). The photoresist film is made from this photopolymer composition. In the general formulas (I) and (II), R<SP>1</SP>and R<SP>2</SP>independently represents an alkyl group of 1-10 carbon, an aryl group of 6-20 carbon, a 6-20C alkyl group substituted aryl group, and a 6-20C aryl oxy substituted aryl group or a 6-20C alkoxy group substituted aryl group, respectively. R<SP>7</SP>and R<SP>8</SP>independently represent hydrogen, a 1-10C alkyl group, a 6-20C aryl group, and a 1-10C alkoxy group or a 6-20C aryl oxy group, respectively. Further, X is a formula representing a divalent group (R<SP>3</SP>to R<SP>6</SP>independently represents hydrogen, a 1-10C alkyl group, or a 1-10C alkoxy group, respectively). <P>COPYRIGHT: (C)2005,JPO&NCIPI |
