Over-molded Thin Film Keypad Assembly,申请号KR20050011807U-传众专利搜索

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发明名称	Over-molded Thin Film Keypad Assembly
摘要
申请公布号	KR200390045(Y1)	申请公布日期	2005.07.18
申请号	KR20050011807U	申请日期	2005.04.27
申请人		发明人
分类号	H01H13/70;(IPC1-7):H01H13/70	主分类号	H01H13/70
代理机构		代理人
主权项
地址

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