HIGH CURRENT FEED-THROUGH DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a feed-through device having a significantly improved current processing capacity in relation to a given device with similar form factors.

SOLUTION: The current processing capacity of the device is improved by changing a geometrical shape of a component which causes a significant decrease in the internal resistance of a feed-through capacitor. Conductive layers placed between semiconductor layers one after another are characterized by comprising either of a main signal transmitting conductor or a transient voltage grounding conductor. The main signal transmitting conductor lies almost along the shorter side of the feed-through device and is characterized by having a practically wide current path. The transient voltage grounding conductor lies along the longer side of the feed-through device almost perpendicular to the main signal transmitting conductor.

COPYRIGHT: (C)2005,JPO&NCIPI