发明名称 ELECTRONIC COMPONENT MOUNTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To enable it to maintain high accuracy in mounting electronic components to a printed circuit board in simple structure by the capability of responding to the thermal expansion, even if a beam and a guiding body expand thermally due to the operation of a device wherein mounted electronic components. <P>SOLUTION: The electronic component mounting device is provided with: a beam 10 which moves in the direction of Y along with the guide rail 8 of a guide body 6 arranged respectively on a pair of support bases 5A, 5B fixed to a machine base 2, by the drive of a linear motor 7; a mounting head 27 which moves in the direction of X along with a guide rail 21 arranged in the beam 10, by the drive of a linear motor 20; and two or more component supply units 3 which supply electronic components. The other support body 5A is arranged in between two sheets of plate bodies 32, with a gap consisted and provided in the longitudinal direction between both the plate bodies 32, while broad up-and-down portions 33A are fixed to the plate bodies 32, and narrow intermediate portions 33B are composed of two or more reinforcing plates 33 estranged from both the plate bodies 32. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005228971(A) 申请公布日期 2005.08.25
申请号 JP20040037090 申请日期 2004.02.13
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 SHUYAMA SHUJI;KASHIWATANI NAOKATSU
分类号 H05K13/04 主分类号 H05K13/04
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