| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide the manufacturing method of a wiring board incorporating a passive element, with which a fine region in swelling of an insulating layer due to embedding of the passive element can easily be polished, without generating cracks between the passive element and the insulating layer, and adhesion strength of the insulating layer and wiring is improved. <P>SOLUTION: The method includes (1) a process of arranging the passive element on a lower insulating layer 1, (2) a process of laminating insulating resin 4 on the lower insulating layer and the passive element and forming the insulating layer incorporating the passive element, and (3) a process of polishing the insulating layer, by using a mask M where a slit S is formed at a position corresponding to the passive element and planarizing the swelling part of the insulating layer due to the passive element. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
