| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve strength with respect to stresses occurring in bonding pads. <P>SOLUTION: A plurality of bonding pads 1 are provided on a semiconductor chip. Each bonding pad 1 is equipped with a plurality of second metals 12 in a line under a first metal 11 formed by using an uppermost wiring layer. The bonding pads 1 are arranged in the longitudinal direction of the second metals 12; that is, the bonding pads 1 are arranged so that the longitudinal direction L1 of the second metals 12 is the same as the arranged direction L2 of the bonding pads 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
