发明名称 Microelectromechanical device using resistive electromechanical contact
摘要 A microelectromechanical device that transmits an electric signal using mechanical contact between conductors is provided. The microelectromechanical device has a conductive oxide layer on at least one of contacting surfaces of the conductors. The conductor may be a signal line or a contact pad. According to the microelectromechanical device, the signal line or the contact pad is coated with the conductive oxide layer, thereby preventing the occurrence of micro-welding problem due to resistive heat. As a result, a reliability and a power handling of a microelectromechanical device can be improved.
申请公布号 US6963117(B2) 申请公布日期 2005.11.08
申请号 US20020230563 申请日期 2002.08.29
申请人 ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE 发明人 YANG WOO-SEOK;JUNG SUNG-HAE;KANG SUNG-WEON;KIM YUN-TAE
分类号 H01H1/20;H01H59/00;(IPC1-7):H01L29/82 主分类号 H01H1/20
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