发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND FILM CURED OBJECT THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of forming a film cured object excellent in ink repellency, ink dropping property, adhesion to a substrate and film appearance, capable of fine pattern formation, and ensuring ink wettability of a substrate surface freed of an unexposed portion after alkali development. <P>SOLUTION: The photosensitive resin composition contains a resin (A) obtained by polymerizing monomer components including a fluorine-atom-containing monomer, a resin (B) obtained by polymerizing monomer components including a silicon-atom-containing monomer, an alkali-soluble resin (C) having an acidic group and six or more ethylenic double bonds in one molecule, and a radical initiator (D), wherein a proportion of the resin (A) to the total solid content of the photosensitive resin composition is 0.05-30 mass% and a proportion of the resin (B) is 0.01-20 mass%. A film cured object of the composition is also provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005315985(A) 申请公布日期 2005.11.10
申请号 JP20040131489 申请日期 2004.04.27
申请人 ASAHI GLASS CO LTD 发明人 TAKAHASHI HIDEYUKI;ISHIZEKI KENJI
分类号 G03F7/033;G02B5/20;G03F7/075 主分类号 G03F7/033
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