| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device mounting method that enables satisfactory connection even if a substrate is not flat. <P>SOLUTION: The semiconductor device mounting method comprises a first step 21 of leveling a plurality of bumps 12 of a semiconductor 11 on a mother substrate 14; a second step 22 of thereafter transferring a silver paste 15 on the plurality of leveled bumps 12a of the semiconductor device 11a; and a third step 22 of thereafter mounting the plurality of bumps 12a, on which the silver paste 15 is transferred, on the position of the mother substrate 14 that is leveled by the first step 21. This enables satisfactory connection of the semiconductor device 11a even if the mother substrate 14 is not flat. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
