| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To avoid rupture of the solder part between a circuit board and a surface-mounted component, using a simple constitution with respect to downward or upward external pressure. <P>SOLUTION: The circuit board 2 for mounting the surface-mounted component 3 of a semiconductor has a plurality of slit holes 5 to 8, formed nearby corners of the surface-mounted component 3 mounted on the circuit board 2. Consequently, even when external pressure is applied to corner parts 2A to 2D of the circuit substrate 2 on which stress tends to concentrate, the circuit board 2 can be physically separated into the inner peripheral side and the outer peripheral side of the slit holes 5 to 8 to avoid deformations, such as flection and curvature of peripheral parts nearby the corners of the circuit board 2 nearby the corners of the surface-mounted component 3; even when the corners 2A to 2D of the circuit board 2 flex, thereby avoiding rupture of the solder between the surface-mounted component 3 and the circuit board 2. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
