发明名称 MULTILAYERED SUBSTRATE WITH BUILT-IN COIL, SEMICONDUCTOR CHIP, AND MANUFACTURING METHOD THEREOF
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a multilayered substrate with a built-in coil which is reduced in noise and crosstalk due to the built-in coil in the substrate or bad influence by floating capacitance, and to provide its manufacturing method. <P>SOLUTION: The multilayered substrate with a built-in coil comprises a coil which is integrally formed with the multilayered substrate, comprises a winding parallel to the multilayered substrate, and a winding perpendicular to the multilayered substrate, and is supported within the multilayered substrate; and an insulator which supports the coil, constitutes at least part of an insulator of the multilayered substrate, and consists of stacked insulation layers. Unit windings of the coil have a helical pattern turning in the opposite direction when seen from the direction of adjacent unit windings, and adjacent pairs of the unit windings are connected to each other by the tips or ends of the helical patterns. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2005347286(A) 申请公布日期 2005.12.15
申请号 JP20020156261 申请日期 2002.05.29
申请人 AJINOMOTO CO INC 发明人 SAGAWA KOICHIRO;OSHIMURA MASAHIKO
分类号 H05K1/16;H01F17/00;H01F27/36;H01L23/12;H01L23/522;H01L23/64;H05K3/46;(IPC1-7):H01L23/12 主分类号 H05K1/16
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