发明名称 Heat treatment method, heat treatment apparatus and treatment system
摘要 When a substrate coated with a coating solution which oxidizes at high temperatures is heat-treated, an oxygen concentration of a treatment atmosphere is lowered when the temperature is low. Next, the substrate is heat-treated in the treatment atmosphere of which the oxygen concentration is lowered. Sequentially, the treatment atmosphere is returned to that with the original oxygen concentration after the passage of a predetermined time after completing the heat treatment. Thereby, the substrate can be heat-treated, with the oxidization of the coating solution being controlled.
申请公布号 US6979474(B2) 申请公布日期 2005.12.27
申请号 US20010886213 申请日期 2001.06.22
申请人 TOKYO ELECTRON LIMITED 发明人 MATSUYAMA YUJI;MIZUTANI YOJI;NAGASHIMA SHINJI;YONEMIZU AKIRA
分类号 H01L21/00;H01L21/677;(IPC1-7):B05D3/00 主分类号 H01L21/00
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