| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To securely perform a temporary fixing of solder balls and enable reliable soldering by a reflow process. <P>SOLUTION: In a BGA type semiconductor device, bottomed recesses are formed on a backside of a substrate on which a resin-molded semiconductor chip is provided, and bumps are formed by adhering solder balls to the bottom recesses. Each bottomed recess is provided in a form of grooves arranged around a portion in which the solder ball is placed. The solder ball is securely supported by letting flux applied to the solder ball adhere into the grooves, and the molten solder of the solder ball flows into the grooves during the reflow process. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
