| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To increase a flexibility in a resin package incorporating a semiconductor chip, reduce the number of necessary parts, increase a versatilization in the parts, realize its miniaturization and volume production. <P>SOLUTION: The semiconductor chip buried resin package comprises a semiconductor chip 16 such as a hall element, a resin package main body 5 having the semiconductor chip 16 buried therein and having two adjacent surfaces e, f normal to each other, and lead frames 6 mounted on the outer sides of the two surfaces e, f of the main body 5 along the surfaces e, f to be electrically connected with the semiconductor chip 16 within the main body 5. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
