发明名称 |
Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate |
摘要 |
A boron nitride/resin composite circuit board having high heat dissipation characteristics and high reliability is provided. A boron nitride/resin composite circuit board, including: a plate-shaped resin-impregnated boron nitride sintered body having a plate thickness of 0.2 to 1.5 mm, the plate-shaped resin-impregnated boron nitride sintered body including 30 to 85 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally, the boron nitride particles having an average long diameter of 5 to 50 μm, and 70 to 15 volume % of a resin; and a metal circuit adhered onto both principal planes of the plate-shaped resin-impregnated boron nitride sintered body, the metal circuit being copper or aluminum, wherein: a ratio of a linear thermal expansion coefficient in a plane direction of the resin-impregnated boron nitride sintered body at 40 to 150° C. (CTE1) and a linear thermal expansion coefficient of the metal circuit at 40 to 150° C. (CTE2) (CTE1/CTE2) is 0.5 to 2.0. |
申请公布号 |
US9516741(B2) |
申请公布日期 |
2016.12.06 |
申请号 |
US201414911707 |
申请日期 |
2014.08.12 |
申请人 |
Denka Company Limited |
发明人 |
Hirotsuru Hideki;Nonaka Shuhei;Mitsunaga Toshikatsu;Ikarashi Koki;Miyata Kouji;Nishi Taiki;Inoue Saori;Kobayashi Fumiya |
分类号 |
H05K1/02;H05K1/09;H05K1/03;C08K7/00;H05K3/02;H05K3/38;C08K3/38 |
主分类号 |
H05K1/02 |
代理机构 |
Christensen O'Connor Johnson Kindness PLLC |
代理人 |
Christensen O'Connor Johnson Kindness PLLC |
主权项 |
1. A boron nitride/resin composite circuit board, comprising:
a plate-shaped resin-impregnated boron nitride sintered body having a plate thickness of 0.2 to 1.5 mm, the plate-shaped resin-impregnated boron nitride sintered body comprising 30 to 85 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally, the boron nitride particles having an average long diameter of 5 to 50 μm, and 70 to 15 volume % of a resin; and a metal circuit adhered onto both principal planes of the plate-shaped resin-impregnated boron nitride sintered body, the metal circuit being copper, aluminum, or alloys thereof; wherein:
a ratio of a linear thermal expansion coefficient in a plane direction of the resin-impregnated boron nitride sintered body at 40 to 150° C. (CTE1) and a linear thermal expansion coefficient of the metal circuit at 40 to 150° C. (CTE2) (CTE1/CTE2) is 0.5 to 2.0. |
地址 |
Chuo-Ku, Tokyo JP |