发明名称 Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate
摘要 A boron nitride/resin composite circuit board having high heat dissipation characteristics and high reliability is provided. A boron nitride/resin composite circuit board, including: a plate-shaped resin-impregnated boron nitride sintered body having a plate thickness of 0.2 to 1.5 mm, the plate-shaped resin-impregnated boron nitride sintered body including 30 to 85 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally, the boron nitride particles having an average long diameter of 5 to 50 μm, and 70 to 15 volume % of a resin; and a metal circuit adhered onto both principal planes of the plate-shaped resin-impregnated boron nitride sintered body, the metal circuit being copper or aluminum, wherein: a ratio of a linear thermal expansion coefficient in a plane direction of the resin-impregnated boron nitride sintered body at 40 to 150° C. (CTE1) and a linear thermal expansion coefficient of the metal circuit at 40 to 150° C. (CTE2) (CTE1/CTE2) is 0.5 to 2.0.
申请公布号 US9516741(B2) 申请公布日期 2016.12.06
申请号 US201414911707 申请日期 2014.08.12
申请人 Denka Company Limited 发明人 Hirotsuru Hideki;Nonaka Shuhei;Mitsunaga Toshikatsu;Ikarashi Koki;Miyata Kouji;Nishi Taiki;Inoue Saori;Kobayashi Fumiya
分类号 H05K1/02;H05K1/09;H05K1/03;C08K7/00;H05K3/02;H05K3/38;C08K3/38 主分类号 H05K1/02
代理机构 Christensen O'Connor Johnson Kindness PLLC 代理人 Christensen O'Connor Johnson Kindness PLLC
主权项 1. A boron nitride/resin composite circuit board, comprising: a plate-shaped resin-impregnated boron nitride sintered body having a plate thickness of 0.2 to 1.5 mm, the plate-shaped resin-impregnated boron nitride sintered body comprising 30 to 85 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally, the boron nitride particles having an average long diameter of 5 to 50 μm, and 70 to 15 volume % of a resin; and a metal circuit adhered onto both principal planes of the plate-shaped resin-impregnated boron nitride sintered body, the metal circuit being copper, aluminum, or alloys thereof; wherein: a ratio of a linear thermal expansion coefficient in a plane direction of the resin-impregnated boron nitride sintered body at 40 to 150° C. (CTE1) and a linear thermal expansion coefficient of the metal circuit at 40 to 150° C. (CTE2) (CTE1/CTE2) is 0.5 to 2.0.
地址 Chuo-Ku, Tokyo JP