| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin eliminating difficulty of a conventional technique, used for fine pattern formation in semiconductor production, and enhancing resist sensitivity more than in conventional products, wherein an effect of reduction of a foreign matter or the like after development is expected, and also to provide a novel dithiol compound which is used suitably for production of the positive photosensitive resin. <P>SOLUTION: The positive photosensitive resin has a structure represented by the general formula (1) in its polymer main chain and the dithiol compound is represented by the general formula (2). <P>COPYRIGHT: (C)2006,JPO&NCIPI |
