发明名称 ELECTRONIC COMPONENT MOUNTING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus capable of more precisely mounting and identifying electronic components. <P>SOLUTION: The electronic component mounting apparatus images each reference mark by an imaging means to calculate a predetermined correction amount from a displacement amount between the image position of the imaged reference mark and the proper imaging position of a predetermined reference mark. The electronic component mounting apparatus comprises a detection means 133 for detecting the temperature of a measurement jig 130; a thermoregulator 132 for regulating the temperature of the measurement jig; and a control means 10 for controlling the thermoregulator based on a detection signal from the detection means, and when the imaging means images the reference mark, the measurement jig is controlled to be set at a predetermined temperature. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006093177(A) 申请公布日期 2006.04.06
申请号 JP20040272836 申请日期 2004.09.21
申请人 JUKI CORP 发明人 HASHIGUCHI MOMOE
分类号 H05K13/04 主分类号 H05K13/04
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