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发明名称
CHEMICAL MECHANICAL POLISHING COMPOSITION FOR METAL CIRCUIT
摘要
申请公布号
KR20070047020(A)
申请公布日期
2007.05.04
申请号
KR20050103675
申请日期
2005.11.01
申请人
SAMSUNG CORNING CO., LTD.
发明人
RHEE, JI HOON;EOM, DAE HONG;LEE, SANG ICK
分类号
C09K3/14
主分类号
C09K3/14
代理机构
代理人
主权项
地址
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