| 摘要 |
A semiconductor device production process includes forming, on a prepared SOI wafer, semiconductor functional devices and substrate contacts. The substrate contacts connect to a support substrate of the SOI wafer. The semiconductor device production process also includes forming a pattern that connects the substrate contacts to external connection pads formed on the semiconductor functional devices such that the external connection pads are not connected to each other. The semiconductor device production process also includes measuring conductivity between the external connection pads. |
