发明名称 MOUNTING DEVICE AND MOUNTING METHOD OF ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a mounting device which prevents occurrence of poor mounting owing to heating of a linear motor which drives a mounting tool. <P>SOLUTION: The mounting device is equipped with: the mounting tool 45 which sucks and holds a semiconductor chip 12; the linear motor 53 which has a coil 55 and a magnet 56, and drives the mounting tool in the linear direction to mount the semiconductor chip on a substrate; a thermocouple 58 which detects temperature of the coil of the linear motor; and a controller which reduces a load added to the coil owing to the temperature of the coil, which is detected through the thermocouple. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009200438(A) 申请公布日期 2009.09.03
申请号 JP20080043470 申请日期 2008.02.25
申请人 SHIBAURA MECHATRONICS CORP 发明人 HASHIMOTO MASANORI;IWAMA TETSUYA
分类号 H01L21/60;H01L21/52 主分类号 H01L21/60
代理机构 代理人
主权项
地址