| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device by which exudation of resin is suppressed. <P>SOLUTION: The method for manufacturing the semiconductor device includes steps of: preparing an annular frame 110 and elements located in the frame 110 and to which wiring 112, 113 are connected; arranging an upper mold 210 so as to block an opening part to be regulated by one axial direction end surface of the frame 110 and to cover the wiring 112, 113 and elements; sandwiching the frame 110 by an upper mold 210 and a lower mold 211, press-fixing the upper mold 210 to one axial direction end surface to deform a first axial direction end surface, and press-fixing the lower mold 211 to the other axial direction end surface to deform a second axial direction end surface; and filling up the resin into an internal space to be defined by the upper mold 210, the lower mold 211 and the frame 110 to form a resin part which covers the wiring 112, 113 located inside the internal space and the top of the elements. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
