SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which can reduce damage in appearance such as cracks, chinks, or dents caused by external stress, and can improve yield in the manufacture of a thin semiconductor device. SOLUTION: The semiconductor device includes a light-transmitting substrate having a stepped side surface, and the width of which in a portion above the step and closer to one surface is smaller than that in a portion below the step; a semiconductor layer provided on other surface of the light-transmitting substrate; and a stacked layer consisting of a first light-transmitting resin layer covering one surface and a part of side surface of the light-transmitting substrate and a second light-transmitting resin layer. Either of the first light-transmitting resin layer or the second light-transmitting resin layer is a chromatic color. COPYRIGHT: (C)2009,JPO&INPIT