RESIN-SEALED MODULE

摘要

A bridge section 12 is disposed in an area where mounting sections 11 are opposed to each other such that it is displaced toward a predetermined side. Accordingly, even if the line width of the bridge section 12 is formed larger than that in the related art, the self-alignment phenomenon can occur appropriately in a reflow process. It is thus possible to provide a resin-sealed module having high resin-charging properties and including a circuit substrate on which the bridge section 12 is not broken even if the size of a common land electrode 10 is reduced in accordance with a smaller size of a circuit component 5 and on which a sufficient gap between plural circuit components 5 mounted on the circuit substrate is reliably secured.

主权项

1. A resin-sealed module having a plurality of circuit components sealed with a resin and mounted on a circuit substrate, comprising:
at least one common land electrode located on a first main surface of the circuit substrate, outer electrodes of the plurality of circuit components set at a same potential being connected to the common land electrode, the common land electrode including
a plurality of mounting sections disposed side by side, anda bridge section disposed in an area where the mounting sections are opposed to each other so as to interconnect the mounting sections, wherein one of the outer electrodes of each of the circuit components is connected to a corresponding one of the mounting sections on a one-to-one correspondence basis by using a solder, and the bridge section is displaced toward one of sides of a direction perpendicular to an imaginary line connecting centers of opposing ones of the mounting sections.