HEAT SPREADING MODULE FOR PORTABLE ELECTRONIC DEVICE

摘要

In a heat spreading module for a portable electronic device configured such that a heat pipe is attached along a metal plate with which a heating element is brought into close contact, and heat of a heated region of the metal plate with which the heating element is brought into close contact is transferred to a place on the metal plate apart from the heated region by the heat pipe, the heat pipe is configured such that a container is formed of a pipe, a portion of the container arranged on the heated region is a heated portion, and a portion of the container apart from the heated region is a heat dissipation portion that dissipates heat to the metal plate, and the heated portion is formed in a flat shape, and the heat dissipation portion is formed to be thicker than the heated portion having the flat shape.

主权项

1. A heat spreading module for a portable electronic device configured such that a heat pipe is attached along a metal plate with which a heating element is brought into close contact, and heat of a heated region of the metal plate with which the heating element is brought into close contact is transferred to a place on the metal plate apart from the heated region by the heat pipe, wherein
the heat pipe is configured such that a container is formed of a pipe made of metal, a portion of the container arranged on the heated region is a heated portion, and a portion of the container apart from the heated region is a heat dissipation portion that dissipates heat to the metal plate, the heated portion is formed in a flat shape in such a manner that the container is squashed, and the heat dissipation portion is formed to be thicker than the heated portion having the flat shape, the metal plate has a hole portion having a predetermined length formed in a portion corresponding to the heated region, the heated portion having the flat shape is arranged inside the hole portion, and the heat dissipation portion is brought into close contact with a surface of the place on the metal plate apart from the heated region, and in the heated region, heat is transferred from the heating element to the metal plate and the heated portion.