| 发明名称 |
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A printed circuit board and a method of manufacturing the same is provided. The printed circuit board includes an insulating substrate, a circuit disposed on the insulating substrate, a pair of first reinforcements spatially separated in the insulating substrate, the first reinforcements extending parallel to a surface of the insulating substrate, and a second reinforcement configured to connect the pair of first reinforcements. |
| 申请公布号 |
US2017055345(A1) |
申请公布日期 |
2017.02.23 |
| 申请号 |
US201615084864 |
申请日期 |
2016.03.30 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
KIM Sung-Han;KIM Han;HWANG Mi-Sun;HA Sang-Yul;AHN Seok-Hwan;LEE Kyung-Ho |
| 分类号 |
H05K1/02;H05K3/46;H05K1/11;H05K3/10;H05K3/00 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board comprising:
an insulating layer; a circuit disposed on the insulating layer; a pair of plate-shaped first reinforcements disposed in the insulating layer, the pair being spatially separated; and a second reinforcement configured to connect the pair of plate-shaped first reinforcements. |
| 地址 |
Suwon-Si KR |
