Sputtering Apparatuses and Methods of Manufacturing a Magnetic Memory Device Using the Same

摘要

A sputtering apparatus includes a process chamber in which a sputtering process is performed, a substrate holder provided in the process chamber and fixing a horizontal position of a substrate during the sputtering process, and a first sputter gun provided to be vertically spaced apart from the substrate in the process chamber. The first sputter gun is spaced apart from the substrate by a first horizontal distance during the sputtering process. The first sputter gun is fixed during the sputtering process. The first horizontal distance is a horizontal distance between the substrate and the first sputter gun when viewed from a plan view.

主权项

1. A sputtering apparatus, comprising:
a process chamber; a substrate holder within the process chamber and that is configured to fix a horizontal position of a substrate during a sputtering process; and a first sputter gun vertically spaced apart from the substrate in the process chamber, wherein the first sputter gun is horizontally spaced apart from the substrate by a first distance during the sputtering process, wherein the first sputter gun is fixed at a position during the sputtering process, and wherein the first distance is a distance between the substrate and the first sputter gun.