| 主权项 |
1. A device, comprising:
a substrate comprising a cavity, a first metal layer, and an external power network; a die comprising an internal power network and an internal ground network, wherein the internal power network is coupled to the external power network; a multi-terminal capacitor embedded within the cavity, wherein the multi-terminal capacitor is configured to electrically couple to the internal power network of a die and the internal ground power network of the die, the multi-terminal capacitor including:
a first side;a second side substantially opposite to the first side;a plurality of positive terminals comprising a first positive terminal and a second positive terminal; anda plurality of ground terminals comprising a first ground terminal and a second ground terminal;wherein the first positive terminal and the first ground terminal are on the first side of the multi-terminal capacitor, andwherein the second positive terminal and the second ground terminal are on the second side of the multi-terminal capacitor; a first capacitor metal layer on a surface of the multi-terminal capacitor, wherein the first capacitor metal layer is substantially co-planar with the first metal layer of the substrate, the first capacitor metal layer configured to form a capacitor power network electrically coupled to the first positive terminal, wherein the capacitor power network is configured to be electrically coupled to the internal power network of the die; and a second capacitor metal layer on a surface of the multi-terminal capacitor, wherein the second capacitor metal layer is substantially co-planar with the first metal layer of the substrate, the second capacitor metal layer configured to form a capacitor ground network electrically coupled to the first ground terminal, wherein the capacitor ground network is configured to be electrically coupled to the internal ground network of the die. |
