Slurry composition and method of substrate polishing

摘要

Slurry composition and a method of substrate polishing used in chemical mechanical polishing (CMP). The present invention concerns a slurry composition containing a polishing agent and a water soluble polymer. The slurry composition contains a water soluble polymer that has a solubility parameter in the range of 9.0 to 14.0 and that may contain hetero atoms at a level sufficient to lower the polishing rate near the edges of the polished substrate defined as the region within 1 mm of the outer edge of the polished substrate to a level below the mean polishing rate of the polished substrate. The water soluble polymer may have a mean molecular weight in the range of 200 to about 3,000,000, and the mean molecular weight may be in the range of 200 to 110,000 if hetero atoms are present in the main-chain structure and the SP value is under 9.5.

主权项

1. A chemical-mechanical polishing composition comprising a polishing agent, and a water soluble polymer having a mean molecular weight of about 200 to about 3,000,000 that has a solubility parameter (SP) in the range of 9.0 to 14.0, wherein the water soluble polymer has one or more hetero atoms.