NOVEL CHEMICAL TREATMENT FOR LITHOGRAPHY IMPROVEMENT IN A NEGATIVE TONE DEVELOPMENT PROCESS

摘要

A material layer is formed on a substrate. A negative tone photoresist layer is formed on the material layer. An exposure process is performed on the negative tone photoresist layer. A post-exposure bake (PEB) process is performed on the negative tone photoresist layer. After the exposure process and the PEB process, the negative tone photoresist layer is treated with a solvent. The solvent contains a chemical having a greater dipole moment than n-butyl acetate (n-BA).