| 摘要 |
1337791 Mounting semi-conductor devices; circuit assemblies MINNESOTA MINING & MFG CO 1 Jan 1971 [2 Jan 1970] 152/71 Headings H1K and H1R A mounting pad for a semi-conductor device comprises a flexible dielectric substrate 18 on which is situated a plurality of conductive areas 12, 14, 16, the edges 20, 22 of the substrate 18 being folded on lines crossing the areas 12, 14, 16 so that the latter extend continuously from the top surface of the pad to the lower surface. A device, such as a transistor 26, is mounted on one of the conductive areas 12 with its electrodes connected to the other areas 14, 16, and the parts of the areas 12, 14, 16 on the lower surface of the pad are then available to permit testing of the device. If the device is acceptable the mounting pad is then bonded to a header 38, but if not the device and pad may be discarded. The dielectric substrate 18 may be of paper, plastics or glass-reinforced p.t.f.e. and suitable metals for the conductive areas 12, 14, 16 include Cu, Au, Ag, Ni, & Al. An Au/Ni/Cu multilayer structure is specifically referred to. The abutting faces of the folded edge parts 20, 22 of the substrate 18 may be bonded together or may merely be held by the folded metal areas 12, 14, 16. A strip of mounting pads of the type illustrated is described, as is a mounting pad for an integrated circuit. |
