FAN OUT SYSTEM IN PACKAGE AND METHOD FOR FORMING THE SAME

摘要

Packages and methods of formation are described. In an embodiment, a system in package (SiP) includes first and second redistribution layers (RDLs), stacked die (130,140) between the first (110) and second (210) RDLs, and conductive pillars (120) extending between the RDLs. A molding compound (105) may encapsulate the stacked die and conductive pillars between the first and second RDLs.