NONWICKED HEAT-PIPE COOLED POWER SEMICONDUCTOR DEVICE ASSEMBLY HAVING ENHANCED EVAPORATED SURFACE HEAT PIPES

摘要

At least one of the two pressure plates used for mounting a replaceable power semiconductor device with pressure interfaces is utilized with an evaporating surface enhancement means as an evaporating surface in a nonwicked gravity-return heat pipe. This location of the evaporating surface in close proximity to the heat-emitting power semiconductor device decreases the steady-state thermal resistance as well as decreasing the transient temperature rise for long term heat overloads to produce improved vaporization cooling of the device.