Measuring cathodically sputtered layer thicknesses - using phase contrast light microscopy through vacuum chamber window

摘要

In the microscopic examination of test-pieces, contained in a vacuum chamber used for cathodic sputtering, the contrast depends on the material deposted on the test piece and is pref. used to establish the end of the sputtering. The process can be used to determined the thickness of single-and multi-layers of vapour-deposited coatings in the electronics, microelectronic and optical inds. Process gives accurate control while the vapour-deposn is being carried out.