| 摘要 |
<p>1382203 Semi-conductor devices TRW Inc 16 May 1973 [31 May 1972] 23318/73 Heading H1K A package for a semi-conductor device comprises a header 11 and thermally conductive members 14, 15 each with an aperture 27, 28 respectively therethrough, a semi-conductor device being mounted on a thermally conductive insert (40, Fig. 6, not shown) in the cavity formed by the apertures, and supported on the header, regions of the device being connected to conductive films 23, 24 a member 14 and hence to strip lines 29, 30 via conductive films 32, 33 on member 15. The insert may include a conductive film (42) on which the device rests, and a further film (43) is formed over the edge and lower surface to make contact with the header. Spacer members 13, 16 and a cap 17 complete the package. The device may be connected to the conductive films by flying leads from regions which may be interdigitated in the case of a transistor. Members 14, 15 may be of alumina, insert (40) of beryllia, the conductive films 23, 24 being of gold. Connections to the strip lines 29, 30 may be facilitated by depressions 21, 22 in the side surfaces of member 14. Transistors or diodes suitable for microwave operation may be accommodated.</p> |
