| 摘要 |
A semiconductor package is provided with a metallized fugitive shorting bar across the conductor pads or leads to prevent electrical damage to a semiconductor chip, inserted therein, from static electricity discharges. The process also comprises removing the shorting bar by solder leaching. The shorting bar is screen printed as a thick-film metallized strip or bar across the conductor package. After a semiconductor chip is inserted in the package by the semiconductor manufacturer and the chip attached and sealed, the shorting bar may be removed at the same time the leads are soldered to the package by the solder leaching properties of a tin-lead-silver or tin-lead solder.
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