发明名称 Plating n-conducting regions of semiconductor devices - using photo-electric current to produce thick metal layers
摘要 <p>The n-conducting region of a p-n junction of a semiconductor device is metal plated by irradiating the junction in a plating bath to produce a photo-electric voltage and cause metal deposition at the n-conducting region. The p-conducting region may be plated prior to or during this process using an external voltage source. Method is useful for prodn. of contact layers for diodes or transistors. A thick metal layer can be produced on the n-conducting region. Also the two conducting regions can be coated in a single bath.</p>
申请公布号 DE2348182(A1) 申请公布日期 1975.04.10
申请号 DE19732348182 申请日期 1973.09.25
申请人 SIEMENS AG 发明人 SPAETH,WERNER,DIPL.-PHYS.;NEUBERT,ECKART
分类号 H01L21/00;H01L21/288;H01L31/00;(IPC1-7):H01L21/288 主分类号 H01L21/00
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