发明名称 |
Plating n-conducting regions of semiconductor devices - using photo-electric current to produce thick metal layers |
摘要 |
<p>The n-conducting region of a p-n junction of a semiconductor device is metal plated by irradiating the junction in a plating bath to produce a photo-electric voltage and cause metal deposition at the n-conducting region. The p-conducting region may be plated prior to or during this process using an external voltage source. Method is useful for prodn. of contact layers for diodes or transistors. A thick metal layer can be produced on the n-conducting region. Also the two conducting regions can be coated in a single bath.</p> |
申请公布号 |
DE2348182(A1) |
申请公布日期 |
1975.04.10 |
申请号 |
DE19732348182 |
申请日期 |
1973.09.25 |
申请人 |
SIEMENS AG |
发明人 |
SPAETH,WERNER,DIPL.-PHYS.;NEUBERT,ECKART |
分类号 |
H01L21/00;H01L21/288;H01L31/00;(IPC1-7):H01L21/288 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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