| 摘要 |
A method for sealing two ceramic pieces, a lead frame and a semiconductor chip together involving the application of pressure to a layer of sealing glass composition which remains vitreous throughout the sealing process is disclosed. The sealing glass composition comprises a mixture of sealing glass and zirconium silicate in the volume percentage amounts of 50-62 percent of glass and 50-38 percent of zirconium silicate. The glass components comprise, as a percentage weight of the glass alone, SiO2 about 0-2 percent, PbO about 65-72 percent, ZnO about 5-10 percent, PbF2 about 2-10 percent, CdO about 1-5 percent, TiO2 about 0.5-3 percent and B2O3 about 10-14 percent. |
